Thin film deposition apparatus and method

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118730, 2041921, 204298, 4272555, B05D 306

Patent

active

046649352

ABSTRACT:
Apparatus and method for the deposition of a thin metal film on a surface of a workpiece as the workpiece is positioned adjacent to a deposition source and as the workpiece and deposition source rotate relative to each other about a first axis. The workpiece can also be moved relative to the deposition source about a second axis as the workpiece and the deposition source rotate relative to each other about the first axis. The distance between the workpiece and the deposition source can be adjusted.

REFERENCES:
patent: 3276902 (1966-10-01), Abraham
patent: 3391022 (1968-07-01), Saito
patent: 3464907 (1969-09-01), Froemel et al.
patent: 3573960 (1971-04-01), Duncan
patent: 3752691 (1973-08-01), Little
patent: 4599135 (1986-07-01), Tsunekawa et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film deposition apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film deposition apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film deposition apparatus and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1801559

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.