Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1974-11-01
1977-03-22
Kaplan, Morris
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
118 491, 118 2, 432236, C23C 1500
Patent
active
040135390
ABSTRACT:
A method and apparatus for the deposition of a thin film on a substrate in which a length of the substrate such as for example, flexible plastic film, is transported in a path which follows along a convoluted configuration through a pressure vessel and therein is subjected to deposition effects. Such deposition effects, for example, comprise high frequency sputtering plasma. The helical path is arranged so that the substrate is carried through the influence of the deposition effects a plurality of times and at speeds which are much greater than those of known methods and apparatus. As a result, the deposition of the thin film is more uniform and a high throughput is achieved. Many other advantages are also achieved. In addition to conventional types of cooling, efficient cooling is obtained by magnetically sweeping secondary electrons away from the substrate. Batch and continuous processing are disclosed.
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Coulter Information Systems, Inc.
Kaplan Morris
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