Thin-film depositing apparatus

Details Thin-film depositing apparatus Thin-film depositing apparatus

1999-04-16

2000-07-11

Diamond, Alan

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429802, 20429825, 20429832, 118665, 118712, 118 50, 118715, 118663, 118666, 118667, 118669, 118675, 118676, 118679, 118688, 324715, 324716, 324719, 324691, 3241581, C23C 1454, C23C 1456, C23C 1434, C23C 1400

Patent

active

060867345

ABSTRACT:
A thin-film depositing apparatus of the present invention deposits a sputtered film on a substrate in a sputtering chamber, and removes the substrate having the sputtered film deposited thereon from the sputtering chamber via a load-lock chamber by a robot arm. As a system for controlling the sheet resistance of the sputtered film deposited on the substrate, a measuring device using an eddy current method is mounted in the proximity of a substrate outlet of the load-lock chamber and measures the sheet resistance of the sputtered film of the substrate removed from the substrate outlet. With this structure, it is possible to provide a thin-film depositing apparatus which stably measures the sheet resistance of a thin film deposited on a substrate and performs feedback of the measurement result to control the film deposition conditions so that a thin film to be deposited on a subsequent substrate has a desired thickness.

REFERENCES:
patent: 5698989 (1997-12-01), Nulman

Affiliated with

Also associated with

Rating

Thin-film depositing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin-film depositing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin-film depositing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-538293