Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1990-02-15
1991-05-07
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
30169, 83870, 156254, 156344, B32B 3118
Patent
active
050133926
ABSTRACT:
A hologram delamination tool is described in which a frame has a cutting blade fastened to one side thereof such that the blade is tautly disposed across a channel formed in the frame. A pressure plate is slidably inserted into the channel to hold the blade flat such that when the cutting tool is used to delaminate a hologram from a substrate, the pressure plate keeps the thin blade from buckling and is retracted during the cutting by the force of the edge of the delaminating hologram to allow the hologram to rest on the top surface of the blade so that the hologram can be lifted away from the substrate upon completion of the delamination.
REFERENCES:
patent: 4469550 (1984-09-01), O'Steen, Jr.
patent: 4625611 (1986-12-01), Bauman
patent: 4654923 (1987-04-01), Faciane et al.
patent: 4779301 (1988-10-01), Millette
patent: 4793061 (1988-12-01), Rizzo, Jr.
patent: 4855012 (1989-08-01), Sumi
patent: 4898058 (1990-02-01), Seifert
Alkov Leonard A.
Ball Michael W.
Denson-Low Wanda K.
Hughes Aircraft Company
Osele Mark A.
LandOfFree
Thin film delamination tool does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin film delamination tool, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film delamination tool will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-937487