Thin film delamination tool

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

30169, 83870, 156254, 156344, B32B 3118

Patent

active

050133926

ABSTRACT:
A hologram delamination tool is described in which a frame has a cutting blade fastened to one side thereof such that the blade is tautly disposed across a channel formed in the frame. A pressure plate is slidably inserted into the channel to hold the blade flat such that when the cutting tool is used to delaminate a hologram from a substrate, the pressure plate keeps the thin blade from buckling and is retracted during the cutting by the force of the edge of the delaminating hologram to allow the hologram to rest on the top surface of the blade so that the hologram can be lifted away from the substrate upon completion of the delamination.

REFERENCES:
patent: 4469550 (1984-09-01), O'Steen, Jr.
patent: 4625611 (1986-12-01), Bauman
patent: 4654923 (1987-04-01), Faciane et al.
patent: 4779301 (1988-10-01), Millette
patent: 4793061 (1988-12-01), Rizzo, Jr.
patent: 4855012 (1989-08-01), Sumi
patent: 4898058 (1990-02-01), Seifert

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film delamination tool does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film delamination tool, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film delamination tool will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-937487

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.