Thin film circuits with high density connector

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

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257673, 257786, 257741, H01L 2943, H01L 310224

Patent

active

054632420

ABSTRACT:
A method of fabricating a high density thin film circuit includes the step of bonding a high density connector having a plurality of electrical connection lines with a wafer having a plurality of electrical contact pads arranged in a pattern with a pitch less than about 100 .mu.m so that an electrical coupling is formed between respective ones of the wafer contact pads and corresponding ones of connector electrical connection lines. The step of forming the electrical coupling comprises pyrolysis of an adhesive disposed between the high density connector and said wafer. The electrical coupling between respective ones of the contact pads and corresponding electrical connection lines is formed by directing a laser beam on the area in which the electrical coupling is to be formed so as to cause thermal decomposition of the adhesive to form a conductive carbon material; portions of the wafer contact pad and the connector electrical connection line are also welded to the conductive carbon material due to the thermal heating of the pulse laser.

REFERENCES:
patent: 5290732 (1994-03-01), Kumar et al.
patent: 5303074 (1994-04-01), Salisbury
patent: 5316204 (1994-05-01), Takehashi et al.
patent: 5349238 (1994-09-01), Ohsawa et al.
G. Kramer, Thin-Film-Transistor Switching Matrix for Flat-Panel Displays, Proceeding of the S.I.D., vol. 16/3, Third Quarter 1975, pp. 152-158.

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