Thin film circuit board manufacturing process

Details Thin film circuit board manufacturing process Thin film circuit board manufacturing process

1994-06-23

1995-05-23

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

216 83, 216 99, B44C 122, C03C 1500, B29C 3700

Patent

active

054178002

ABSTRACT:
A process for manufacturing a thin film circuit board includes forming an insulator layer having a relatively high etching rate in a desired thickness on an insulator layer having a relatively low etching rate and a relatively high dielectric constant, arranging a conductor layer on the insulator layer having a relatively high etching rate, selectively removing the insulator having a relatively high etching rate by etching but excluding a portion located beneath the conductor layer, forming an insulator portion that contains the insulator layer having a relatively high etching rate and supports the conductor layer in the undercut state, forming an insulator layer having a relatively low dielectric constant so as to surround the entire conductor layer, and forming an insulator layer having a relatively high dielectric constant on top of the insulator layer having a relatively low dielectric constant so as to surround the entire insulator layer having a relatively low dielectric constant.

REFERENCES:
patent: 4572765 (1986-02-01), Berry
patent: 4943346 (1990-07-01), Mattelin
patent: 4990218 (1991-02-01), Tezaki et al.

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