Thin film circuit board and its manufacturing process

Details Thin film circuit board and its manufacturing process Thin film circuit board and its manufacturing process

1993-02-18

1994-11-08

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

528353, B32B 900

Patent

active

053625501

ABSTRACT:
A thin film circuit board has an insulator layer and a conductor layer embedded in the insulator layer and supported in an undercut state by an insulator. The entire conductor layer, excluding the portion supported by the insulator, is surrounded by an insulator having a relatively low dielectric constant which in turn is surrounded by an insulator having a relatively high dielectric constant. The insulator portion that supports the conductor layer in the undercut state has a relatively high etching rate and is formed in a desired thickness on an insulator layer having a relatively low etching rate.

REFERENCES:
patent: 3770573 (1973-11-01), Dunphy et al.
patent: 4937133 (1990-06-01), Watanabe et al.
patent: 5196500 (1993-03-01), Kreuz et al.

Affiliated with

Also associated with

Rating

Thin film circuit board and its manufacturing process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film circuit board and its manufacturing process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film circuit board and its manufacturing process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1780902