Thin film chip-type filter with an external electrode formed on

Wave transmission lines and networks – Coupling networks – Frequency domain filters utilizing only lumped parameters

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336200, 336232, 29830, 428210, 333185, H03H 709

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active

056990251

ABSTRACT:
A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.

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Patent Abstracts of Japan, vol. 013, No. 186, 2 May 1989 & JP-A-01012510 (Matsushita Electric Ind Co Ltd) 17 Jan. 1989, Abstract.
European Search Report dated Aug. 23, 1994.

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