Thin film ceramic multilayer wiring hybrid board

Details Thin film ceramic multilayer wiring hybrid board Thin film ceramic multilayer wiring hybrid board

1993-03-08

1995-03-07

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361795, 361767, 174255, H05K 100

Patent

active

053960343

ABSTRACT:
A ceramic thin film hybrid circuit board is provided by flattening the surface of a ceramic multi-layer interconnection substrate, forming capture pads on the flattened surface, filling spaces between the capture pads with an insulating layer composed of a glass material or an organic resin material, grinding the resultant surface until the capture pads are exposed to flatness, and laminating a plurality of thin film interconnection layers on the flattened surface. The ceramic thin film hybrid circuit board has an increased package density of mounted electronic parts such as LSIs and the like because failures of thin film interconnection layer generated owing to the roughness of the surface of the ceramic substrate, defects such as voids and the hollows produced with the capture pads are greatly reduced, and is very suitable for large scale electronic computers, in which the wiring length is reduced so as to reduce the signal delay.

REFERENCES:
patent: 4084314 (1978-04-01), Chakrabarty et al.
patent: 4685033 (1987-08-01), Inoue
patent: 4721831 (1988-01-01), Vora
patent: 4736521 (1988-04-01), Dohya
patent: 5081563 (1992-01-01), Feng et al.
patent: 5110664 (1992-05-01), Nakanishi et al.
patent: 5157589 (1992-10-01), Cole, Jr. et al.

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