Thin film capillary process and apparatus

Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate

Reexamination Certificate

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Details

C216S095000, C216S097000, C216S099000, C216S100000

Reexamination Certificate

active

06649078

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to microfluidic substrates, and more specifically, it relates to the formation of microfluidic capillaries.
BACKGROUND OF THE INVENTION
Microfluidic technology represents a revolution in laboratory experimentation. Microfluidic circuits allow for scientific experiments that used to be performed at the laboratory bench to be done in volumes as small as a nanoliter. Microfabrication makes it possible to create intricate designs of interconnected channels that are extremely small. Each pattern is designed to produce a series of fluid manipulation steps that will execute an experiment. Hoewever, current capillary electrophoresis on a chip often requires glass to glass or quartz to quartz bonding to form the interconnected channels.
SUMMARY OF THE INVENTION
Aspects of the present invention include a method comprising: depositing a first layer on a substrate surface; depositing a second layer on the first layer; depositing a third layer on the second layer; and removing the second layer to form a capillary between the first and third layers.
Further aspects of the present invention include an apparatus comprising: a substrate having a capillary lined with a material from the group consisting of glass, quartz, polysilicon, silicon nitride, silicon dioxide, and boron nitride/silicon dioxide.


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