Thin film capacitor, thin film capacitor array and...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257S533000, C257S595000, C365S149000

Reexamination Certificate

active

07009276

ABSTRACT:
A thin film capacitor with small electrode resistance and great Q-value which comprises a small number of thin films that are deposited successively is disclosed. It is effective for miniaturization and high density packaging of a device and for preventing poor characteristics and degradation of reliability. A plurality of lower electrodes2are provided on a supporting substrate1, which are spaced apart from each other in a high frequency signal propagation direction P. Two upper electrodes5spaced apart from each other in the high frequency signal propagation direction P are provided on one of the plurality of the lower electrodes2through a thin film dielectric layer4, by which two capacitance elements are formed. The upper electrodes5are connected together by an extraction electrode8so that the two capacitance elements are connected in series. A maximum distance L1between the two upper electrodes5in the high frequency signal propagation direction P is smaller than a minimum length W1of the upper electrodes5in the direction perpendicular to the high frequency signal propagation direction P in plan view.

REFERENCES:
patent: 4870541 (1989-09-01), Cole
patent: 5472935 (1995-12-01), Yandrofski et al.
patent: 5589845 (1996-12-01), Yandrofski et al.
patent: 5694134 (1997-12-01), Barnes
patent: 5721194 (1998-02-01), Yandrofski et al.
patent: 5892266 (1999-04-01), Hirota et al.
patent: 2004/0164819 (2004-08-01), Mishima et al.
patent: 08-509103 (1996-09-01), None
patent: 11-260667 (1999-09-01), None

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