Thin film capacitor, high-density packaging substrate...

Metal working – Electric condenser making – Solid dielectric type

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S025410, C029S842000, C029S846000, C029S852000, C029S854000

Reexamination Certificate

active

07836567

ABSTRACT:
A capacitor capable of being incorporated into a packaging substrate, which capacitor includes a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching the high-dielectric-constant layer from the upper side and the lower side. A packaging substrate containing the capacitor, and a method for producing the same are also provided.

REFERENCES:
patent: 5907470 (1999-05-01), Kita et al.
patent: 5973908 (1999-10-01), Saia et al.
patent: 6096592 (2000-08-01), Cho
patent: 6339527 (2002-01-01), Farooq et al.
patent: 6624501 (2003-09-01), Shioga et al.
patent: 6747334 (2004-06-01), Kitagawa et al.
patent: 6818469 (2004-11-01), Mori et al.
patent: 6853051 (2005-02-01), Shioga et al.
patent: 7227736 (2007-06-01), Shioga et al.
patent: 2003/0136997 (2003-07-01), Shioga et al.
patent: 8264721 (1996-10-01), None
patent: 9102590 (1997-04-01), None
patent: 10-079471 (1998-03-01), None
patent: 11-163273 (1999-06-01), None
patent: 11-214434 (1999-08-01), None
patent: 11-346061 (1999-12-01), None
patent: 11-354729 (1999-12-01), None
patent: 2000-306767 (2000-11-01), None
patent: 2002-222925 (2002-08-01), None
patent: 1999-0083104 (1999-11-01), None
patent: 2002-0024414 (2002-03-01), None
Zhilum Gui, et al., “Composite MLCCs with X7R Characteristics,”Proceedings of the 2000 12thIEEE International Symposium Applications of Ferroelectrics, vol. II, pp. 821-824 (Jul. 21 to Aug. 2, 2000).
Japanese Office Action (Decision to Grant a Patent) dated May 18, 2010 issued in corresponding Japanese Application No. 2004-052400 (including partial English translation).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film capacitor, high-density packaging substrate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film capacitor, high-density packaging substrate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film capacitor, high-density packaging substrate... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4220780

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.