Thin film capacitor, high-density packaging substrate...

Details Thin film capacitor, high-density packaging substrate... Thin film capacitor, high-density packaging substrate...

2007-03-27

2007-03-27

Ha, Nguyen T. (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S301100, C361S301400, C361S321200, C361S306100, C361S306300, C361S311000, C361S313000

Reexamination Certificate

active

10974789

ABSTRACT:
A capacitor capable of being incorporated into a packaging substrate, which capacitor includes a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching the high-dielectric-constant layer from the upper side and the lower side. A packaging substrate containing the capacitor, and a method for producing the same are also provided.

REFERENCES:
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patent: 6339527 (2002-01-01), Farooq et al.
patent: 6747334 (2004-06-01), Kitagawa et al.
patent: 6818469 (2004-11-01), Mori et al.
patent: 6853051 (2005-02-01), Shioga et al.
patent: 11-163273 (1999-06-01), None
patent: 2002-0024414 (2002-03-01), None
Zhilum Gui, et al., “Composite MLCCs with X7R Characteristics,”Proceedings of the 2000 12THIEEE International Symposium Applications of Ferroelectrics, vol. II, pp. 821-824 (Jul. 21 to Aug. 2, 2000).

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