Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-02-15
2011-02-15
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S025030, C029S829000, C029S832000
Reexamination Certificate
active
07886436
ABSTRACT:
Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; anda method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.
REFERENCES:
patent: 5453908 (1995-09-01), Tsu et al.
patent: 6184044 (2001-02-01), Sone et al.
patent: 6402304 (2002-06-01), Qiu et al.
patent: 6806553 (2004-10-01), Yashima et al.
patent: 6818469 (2004-11-01), Mori et al.
patent: 6900498 (2005-05-01), Stauf et al.
patent: 7172818 (2007-02-01), Nakaoka et al.
patent: 7349198 (2008-03-01), Yano et al.
patent: 7541626 (2009-06-01), Kim et al.
patent: 2001/0006833 (2001-07-01), Lee et al.
patent: 2006/0012279 (2006-01-01), Nanataki et al.
patent: 2006/0022304 (2006-02-01), Rzeznik
patent: 2006/0057420 (2006-03-01), Yokota et al.
patent: 2006/0163725 (2006-07-01), Haba et al.
patent: 2006/0234852 (2006-10-01), Kim et al.
patent: 2007/0085166 (2007-04-01), Moon et al.
patent: 2007/0094871 (2007-05-01), Moon et al.
patent: 2007/0177331 (2007-08-01), Das et al.
patent: 2008/0110667 (2008-05-01), Ahn et al.
patent: 2009/0026887 (2009-01-01), Fujii et al.
patent: 04-285046 (1992-10-01), None
patent: 05-251258 (1993-09-01), None
patent: 06-162857 (1994-06-01), None
patent: 09-246720 (1997-09-01), None
patent: 11-214853 (1999-08-01), None
patent: 2000-252611 (2000-09-01), None
patent: 2001-223346 (2001-08-01), None
patent: 2005-045099 (2005-02-01), None
patent: WO 2004/040604 (2004-05-01), None
Japanese Office Action issued in Japanese Patent Application No. 2006-301545, mailed Feb. 17, 2009.
Chung Yul Kyo
Lyoo Soo Hyun
Moon Jin Seok
Sohn Seung Hyun
McDermott Will & Emery LLP
Parvez Azm
Samsung Electro-Mechanics Co. Ltd.
Tugbang A. Dexter
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