Thin-film capacitor device, mounting module for the same,...

Details Thin-film capacitor device, mounting module for the same,... Thin-film capacitor device, mounting module for the same,...

2007-10-16

2007-10-16

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Making passive device

C438S393000, C438S396000

Reexamination Certificate

active

11103449

ABSTRACT:
The invention is directed to a thin-film capacitor device that is adapted to be mounted on a printed wiring board together with an LSI device. After forming a plurality of grooves in a core substrate, a first conductive film is formed, and a first conductor is filled into each groove. After forming a metal film on the first conductive film, a dielectric film is generated by selective anodic oxidation of the metal film. A second conductive film is formed on the dielectric film, and an electrode connected to the second conductive film is formed. After removing the back surface of the core substrate until the grooves are exposed therein, an electrode for connection to the first conductor in each groove is formed. A capacitor is formed by the first conductive film and second conductive film sandwiching the dielectric film therebetween.

REFERENCES:
patent: 6370012 (2002-04-01), Adae-Amoakoh et al.
patent: 6446317 (2002-09-01), Figueroa et al.
patent: 6897544 (2005-05-01), Ooi et al.
patent: 6998308 (2006-02-01), Ooi et al.
patent: 2002/0070400 (2002-06-01), Shibuya et al.
patent: 2002-008942 (2002-01-01), None
U.S. Appl. No. 10/673,484, filed Sep. 30, 2003, Tomoo Yamasaki, et al., Shinko Electric Industries Co., Ltd.

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