Thin film capacitor coupons for memory modules and multi-chip mo

Details Thin film capacitor coupons for memory modules and multi-chip mo Thin film capacitor coupons for memory modules and multi-chip mo

1997-05-23

1999-11-09

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257924, H01L 2900, H01L 2302

Patent

active

059820187

ABSTRACT:
A semiconductor device including a thin coupon capacitor mounted to the backside of a semiconductor die. When mounted active surface up on a carrier substrate of a multi-chip module, the coupon is secured between the backside of the die and the substrate. When flip-chip connections or direct chip attach are employed between the die and substrate, the coupon is secured to the backside of the die. The coupons may be preformed, or formed on the die in a wafer-scale fabrication process prior to singulation of the dice.

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