Thin film bulk acoustic wave resonator

Wave transmission lines and networks – Coupling networks – Electromechanical filter

Reexamination Certificate

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Details

C333S189000, C333S191000, C310S324000, C310S349000

Reexamination Certificate

active

06870445

ABSTRACT:
The present invention is intended to provide a thin film bulk acoustic wave resonator, which has a resonant excitation portion free from damage caused by etching, a high electromechanical coupling coefficient kt2and a high quality coefficient Q value, and to provide a thin film bulk acoustic wave resonator having a plurality of different resonant frequencies, which can be formed on the same substrate without increasing number of lithography process.An internal cavity is provided in a semiconductor or insulative substrate such as crystal silicon. The thin film bulk acoustic wave resonator has a layered member comprising a first electrode film, a piezoelectric film and a second electrode film on a thin wall of e.g. single crystal over the internal cavity.

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patent: 5872493 (1999-02-01), Ella
patent: 6047590 (2000-04-01), Namerikawa et al.
patent: 6495945 (2002-12-01), Yamaguchi et al.
patent: 6741147 (2004-05-01), Harris
patent: 2000-012858 (2000-01-01), None
patent: 2001-168674 (2001-06-01), None

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