Electricity: electrical systems and devices – Miscellaneous
Patent
1981-06-26
1985-10-01
Kucia, R. R.
Electricity: electrical systems and devices
Miscellaneous
361386, 357 81, H05K 118
Patent
active
045449899
ABSTRACT:
A substrate for wiring an electrical component in an electrical circuit comprises a base substrate, a first insulating layer of an organic material formed over the base substrate, a wiring member formed on the first insulating layer, coupled to the component, a second insulating layer of an organic material formed over the first insulating layer, and a terminal member on the first insulating layer and appearing from the second insulating layer, connected to the wiring member. A third insulating layer of an organic material may be interposed between the first and the second insulating layers, carrying a second wiring member connected to the first wiring member.
REFERENCES:
patent: 3249818 (1966-05-01), Hwang et al.
patent: 3365620 (1968-01-01), Butler et al.
patent: 3614832 (1971-10-01), Chance et al.
patent: 3622384 (1971-11-01), Davey et al.
patent: 3875478 (1975-04-01), Capstick
patent: 3936866 (1976-02-01), Grossman et al.
patent: 4240098 (1980-12-01), Zory et al.
patent: 4420364 (1983-12-01), Nukii et al.
Coombs et al., High Performance Package with Conductive Bonding to Chips, IBM Tech. Disc. Bull., V. 22, #10 Mar. 1980, pp. 4469 & 4470.
E. Stephens, Unit-Module Lead Frame Using Polyimide, IBM Tech. Disc. Bull., V. 11, #8, Jan. 1969, pp. 990 & 991.
Awane Katunobu
Iwasaki Masaru
Matsuda Yuji
Nakabu Shigeo
Nukii Takashi
Kucia R. R.
Sharp Kabushiki Kaisha
LandOfFree
Thin assembly for wiring substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin assembly for wiring substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin assembly for wiring substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1445607