Thin adhesive sheet for working semiconductor wafers

Details Thin adhesive sheet for working semiconductor wafers Thin adhesive sheet for working semiconductor wafers

1997-09-19

2000-01-04

Krynski, William

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428345, 428355, B32B 712

Patent

active

060107820

ABSTRACT:
A thin adhesive sheet for working semiconductor wafers is described, comprising a light-permeable support and a pressure-sensitive adhesive layer on the support, wherein the adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon--carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator. This adhesive sheet is firmly bonded to a semiconductor wafer during the wafer cutting process, the adhesive force of the adhesive sheet is markedly reduced. As a result, the pick-up operation can be carried out easily. This adhesive sheet is useful in working semiconductor wafers.

REFERENCES:
patent: 4312916 (1982-01-01), Kakumaru et al.
patent: 4379201 (1983-04-01), Heilmann et al.
patent: 4522870 (1985-06-01), Esmay
patent: 5637395 (1997-06-01), Uemura et al.
patent: 5714029 (1998-02-01), Uemura et al.

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