Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Patent
1994-02-14
1997-06-10
Ryan, Patrick J.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
428345, 428355, B32B 712
Patent
active
056373953
ABSTRACT:
A thin adhesive sheet for working semiconductor wafers is described, comprising a light-permeable support and a pressure-sensitive adhesive layer on the support, wherein the adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon-carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator. This adhesive sheet is firmly bonded to a semiconductor wafer during the wafer cutting process whereafter and during the wafer polishing process. After irradiation, the adhesive force of the adhesive sheet is markedly reduced. As a result, the pick-up operation can be carried out easily. This adhesive sheet is useful in working semiconductor wafers.
REFERENCES:
patent: 3983297 (1976-09-01), Ono et al.
patent: 4181752 (1980-01-01), Martens et al.
patent: 4286047 (1981-08-01), Bennett et al.
patent: 4311759 (1982-01-01), Glennon
patent: 4312916 (1982-01-01), Kakumaru et al.
patent: 4379201 (1983-04-01), Heilmann et al.
patent: 4522870 (1985-06-01), Esmay
Patent Abstract of Japan, vol. 5, No. 179 (Nov. 17, 1981).
English Translation of Claim of JP-B2-58-50164.
English Translation of Claim of JP-A-59-21038.
Satoda Yoshinari
Shigemura Eiji
Uemura Gosei
Gray J. M.
Nitto Electric Industrial Co. Ltd.
Ryan Patrick J.
LandOfFree
Thin adhesive sheet for working semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin adhesive sheet for working semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin adhesive sheet for working semiconductor wafers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-763396