Cutting – Processes
Patent
1976-05-05
1977-09-06
Meister, J. M.
Cutting
Processes
83368, 83560, 83556, B26D 506, B26D 726
Patent
active
040460398
ABSTRACT:
A variable-position die set for trimming metal or other sheet stock to a particular length which is determined by the stock thickness, including upper and lower actuating die plates, a stationary cutting block arrangement positioned between and secured to the die plates, and a movable cutting block arrangement positioned between the die plates in spaced parallel relationship with the stationary cutting block arrangement. Stock thickness-sensing apparatus is also positioned between the lower and upper actuating die plates. Operatively associated with the sensing apparatus is a device for positioning the movable cutting block arrangement in relation to the sensed stock thickness.
REFERENCES:
patent: 3555945 (1971-01-01), Warthen
EMF, Inc.
Meister J. M.
LandOfFree
Thickness responsive variable position die set does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thickness responsive variable position die set, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thickness responsive variable position die set will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2157373