Thick film substrate with highly thermally conductive metal base

Details Thick film substrate with highly thermally conductive metal base Thick film substrate with highly thermally conductive metal base

1989-09-05

1991-05-28

Miller, Jr., George H.

Recorders

Markers and/or driving means therefor

With ink supply to marker

346 75, H41J 205

Patent

active

050196758

ABSTRACT:
A novel hybrid thick film substrate is enabled by utilizing a highly thermally conductive base metal such as copper. The base metal is passivated by a suitable technique to prevent oxidation. One or more dielectric layers are then screened onto the passivation layer and fired at temperatures upwards of 600.degree. C. The surface of the substrate is then in a condition to accept formation of a conductive pattern or the like.

REFERENCES:
patent: 3613230 (1971-10-01), Griff
patent: 4221925 (1980-09-01), Finey et al.
patent: 4307147 (1981-12-01), Ohishi et al.
patent: 4601777 (1986-07-01), Hawkins et al.
patent: 4786357 (1988-11-01), Campanelli et al.
patent: 4809428 (1989-03-01), Aden et al.

Affiliated with

Also associated with

Rating

Thick film substrate with highly thermally conductive metal base does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thick film substrate with highly thermally conductive metal base, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thick film substrate with highly thermally conductive metal base will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-36742