Thick film sealing glass compositions for low temperature...

Semiconductor device manufacturing: process – Electron emitter manufacture

Reexamination Certificate

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C445S024000, C313S309000

Reexamination Certificate

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08053258

ABSTRACT:
The present invention is a composition that may be used for sealing applications in the manufacture of electronic devices. The composition includes organic vehicles that may be removed upon low temperature firing in air or inert atmospheres. The present invention is further a process for the use of the composition.

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Kwon et. al., Plasma Display Panel Vacuum In-Line Sealing Technology by Using Bubble-Reduced Frit, J. Vacuum Sci. and Technology, A, 2003, pp. 206-211, vol. 21.
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