Thick-film resistor paste

Details Thick-film resistor paste Thick-film resistor paste

1998-02-03

2000-09-26

Gupta, Yogendra

Compositions

Electrically conductive or emissive compositions

Metal compound containing

252500, H01B 102, H01B 106

Patent

active

061238740

ABSTRACT:
A thick-film resistor paste consists of a first glass powder, a second glass powder, a conductive material powder, and an organic vehicle. A quantity of the first glass powder mixed is larger than a quantity of the second glass powder mixed. The first glass powder contains, in total, 95 percentage by weight or above of CaO of 20 to 26 percentage by weight, SiO.sub.2 of 37 to 59 percentage by weight, Al.sub.2 O.sub.3 of 5 to 13 percentage by weight and B.sub.2 O.sub.3 of 8 to 28 percentage by weight. The second glass powder contains, in total, 85 percentage by weight or above of SiO.sub.2 of 53 to 72 percentage by weight, B.sub.2 O.sub.3 of 20 to 30 percentage by weight and Na.sub.2 O of 1 to 7 percentage by weight. The thermal expansion coefficient of the first glass powder is larger by 0.5.times.10.sup.-6 /deg or above than the thermal expansion coefficient of the second glass powder. A glass transition point of the first glass powder is higher by 30 degrees Celsius or above than a glass transition point of the second glass powder.

REFERENCES:
patent: 4302362 (1981-11-01), Hoffman et al.
patent: 5164342 (1992-11-01), Muralidhar et al.
patent: 5474711 (1995-12-01), Borland et al.
patent: 5491118 (1996-02-01), Hormadaly

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