Thick film resistor material and thermal head obtained therefrom

Details Thick film resistor material and thermal head obtained therefrom Thick film resistor material and thermal head obtained therefrom

1989-10-23

1991-06-04

Bell, Mark L.

Compositions

Electrically conductive or emissive compositions

Metal compound containing

501 17, 501 20, 501 32, 252519, H01B 106, C03C 814

Patent

active

050211943

ABSTRACT:
A thermal head obtained by calcining a mixed material comprising at least ruthenium oxide particles having a specific surface area of 10 to 40 m.sup.2 /g and a particle size of 1 .mu.m as the upper limit value of particle size distribution, glass fine particles and a dispersant which disperses these fine particles and disappears by calcining can reduce scattering of resistance values and give high image quality at thermal printing.

REFERENCES:
patent: 3304199 (1967-02-01), Faber, Sr. et al.
patent: 3679607 (1967-10-01), Angus et al.
patent: 4051074 (1977-09-01), Asada
patent: 4175061 (1979-11-01), Fujimura
patent: 4362656 (1982-12-01), Hormadaly
patent: 4415624 (1983-11-01), Prabhu et al.
patent: 4439352 (1984-03-01), Asada et al.

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