Thick film resistor inks

Details Thick film resistor inks Thick film resistor inks

1982-10-05

1984-10-30

Barr, Josephine L.

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

252511, 106 112, 106 20, 524437, 523440, 523457, 523468, 427386, 427 96, H01B 106

Patent

active

044798903

ABSTRACT:
An improved ink composition suitable for the formation of thick film resistor inks which can be terminated directly to copper foil conductors. The subject compositions comprise an epoxy resin, conductive carbon particles, a suitable solvent and particulate alumina, wherein the alumina is present in an amount at least equal to the resin content on a weight basis.

REFERENCES:
patent: 2795680 (1957-06-01), Peck
patent: 3648364 (1972-03-01), Endo
patent: 3896406 (1975-07-01), Anderson et al.
patent: 3956195 (1976-05-01), Izmailovich et al.
patent: 3998779 (1976-12-01), Baer
Inagaki, Journal of Electronic Engineering, Apr., 1980, pp. 38 and 39.
Sargent, Electronic Packaging and Production, Sep., 1981, pp. 65-75.
Fu et al., IEEE Transactions On Components, Hybrids, and Manufacturing Technology, vol. CHMT-4, No. 3, pp. 283-288, (Pt. I) and pp. 289-293 (Pt. II).

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