Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1980-07-03
1982-02-23
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427101, 427102, 427103, 4273763, 427380, 4273835, H05K 312, H01C 1706, H01C 1730
Patent
active
043169201
ABSTRACT:
A method of forming thick film resistor circuits whereby non-noble metals (11, 12) requiring a reducing firing atmosphere are included with resistor material (13) requiring an oxidizing atmosphere. The conductor metallization is capable of adhering to the substrate at a low firing temperature in air. The resistors are printed and fired in air after conductor formation. The metal oxide can then be reduced at a sufficiently low temperature so as not to significantly affect the resistor material. In one embodiment, the conductor paste includes copper and glass frits which can adhere to a ceramic substrate by firing at a temperature of less than 1100 degrees C.
REFERENCES:
patent: 2993815 (1961-07-01), Treptow
patent: 3914514 (1975-10-01), Mackenzie
patent: 4039721 (1977-08-01), Weitze
patent: 4072771 (1978-02-01), Grier, Sr.
patent: 4140817 (1979-02-01), Brown
patent: 4191789 (1980-03-01), Brown
Loasby et al., "Enhanced Property Thick-Film Conductor Pastes", Solid State Technology, pp. 46-57, May 1972.
Katz, "Adhesion of Copper Films to Aluminum Oxide Using a Spinel Structure Interface", Thin Solid Films, 33, pp. 99-105 (1976).
Brown John F.
Stanton Robert M.
Bell Telephone Laboratories Incorporated
Birnbaum Lester H.
Smith John D.
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