Thick film resistor circuits

Details Thick film resistor circuits Thick film resistor circuits

1983-02-23

1985-03-05

Bueker, Richard

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427102, 427103, 427123, 427125, 4271262, 4271263, 4271264, 4271265, 427343, 4273766, 4273767, 427380, 427404, 4274192, 252512, 252514, 252518, H01C 1706

Patent

active

045030901

ABSTRACT:
A method of forming thick film resistor circuits whereby a non-hole metal, such as copper, requiring a reducing atmosphere is included with resistor material requiring an oxidizing atmosphere. A fritless conductor paste with a small percentage of silver is deposited and fired in air at a low temperature. Resistors are then deposited and fired in air. Subsequently, the conductor material is reduced at a sufficiently low temperature so as not to adversely affect the resistors.

REFERENCES:
patent: 3922236 (1975-11-01), Douglas et al.
patent: 4039721 (1977-08-01), Weitze et al.
patent: 4072771 (1978-02-01), Grier
patent: 4140817 (1979-02-01), Brown
patent: 4255291 (1981-03-01), Needes et al.
patent: 4316920 (1982-02-01), Brown
patent: 4409181 (1983-10-01), Coad
Loasby et al, "Enhanced Property Thick-Film Conductor Pastes", Solid State Technology, pp. 46-50, 72, (May 1972).

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