Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1977-11-04
1979-02-20
Esposito, Michael F.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427102, 427103, 427123, 427126, 427343, 427377, 427380, 29620, B05D 512, H01C 1706
Patent
active
041408179
ABSTRACT:
Disclosed is a method and resulting product whereby thick film conductors which require a reducing firing atmosphere may be included in circuits with thick film resistors requiring an oxidizing firing atmosphere. In accordance with one embodiment, a fritless paste including copper is deposited onto a substrate in a desired conductor pattern and fired to establish adhesion. The copper oxide in the pattern is then reduced to copper metal at a high temperature. This is followed by oxidation of the copper to produce a copper oxide of lower density than the oxide formed after the initial firing. The resistor material is then deposited and fired in an oxidizing atmosphere. The low density copper oxide may then be reduced at a low temperature so that resistor properties are not adversely affected.
REFERENCES:
patent: 3998980 (1976-12-01), Antes et al.
Loasby et al., "Enhanced Property . . . Pastes", Solid State Tech. (5-1972), pp. 46-50 & 72 (correction 8-72, p. 57).
Katz, "Adhesion Copper Films . . . Interface", Thin Film Solids, vol. 33, pp. 99-105 (1976).
Bell Telephone Laboratories Incorporated
Birnbaum Lester H.
Esposito Michael F.
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