Thick-film printed substrate including an electrically connectin

Details Thick-film printed substrate including an electrically connectin Thick-film printed substrate including an electrically connectin

1996-04-26

1998-05-19

Tso, Edward

Electrical resistors

With base extending along resistance element

H01C 1012

Patent

active

057540934

ABSTRACT:
A thick-film resistor in a thick-film printed substrate, the resistance of which is maintained at an appropriate value, is disclosed. In a thick-film printed substrate formed by printing a thick-film conductor and a resistor of lanthanum boride type on a ceramic substrate and then sintering, an intermediate resistor layer of lanthanum boride type is provided between the thick-film conductor and the resistor of lanthanum boride type. Reaction of glass composition contained in the thick-film conductor is suppressed, and resistance abnormality is prevented during sintering by causing the intermediate resistor layer of lanthanum boride type to be interposed.

REFERENCES:
patent: 4225468 (1980-09-01), Donohue et al.
patent: 4512917 (1985-04-01), Donohue
patent: 4584553 (1986-04-01), Tokura et al.
patent: 5119272 (1992-06-01), Ohyama et al.
patent: 5383093 (1995-01-01), Nagasaka
patent: 5500553 (1996-03-01), Ikegami
patent: 5549778 (1996-08-01), Yokoyama et al.
patent: 5557252 (1996-09-01), Ariyoshi

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