Thick-film printed circuit board and method for producing the sa

Details Thick-film printed circuit board and method for producing the sa Thick-film printed circuit board and method for producing the sa

1980-07-02

1982-06-22

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 68, 357 65, 357 69, 174 52R, 174 685, H01L 3902, H01L 2348, H01L 2944

Patent

active

043365515

ABSTRACT:
A thick-film printed circuit board and a method for producing the same are disclosed, in which wiring conductors having connecting sections for connection with solder electrodes of an electronic element such as a semiconductor chip are provided on an insulating substrate. A layer of insulating material having through holes at positions corresponding to the connecting terminals of the electronic element is covered on the wiring conductors. Conductor pedestals for connection with the electronic element are filled in the through holes and formed on the insulating layer. Each of the pedestals has an area for contact with the connecting terminals of the electronic element.

REFERENCES:
patent: 2426252 (1949-02-01), Lepselter
patent: 3303265 (1967-02-01), Noren et al.
patent: 3404215 (1968-10-01), Burks et al.
patent: 3483308 (1969-12-01), Wakely
patent: 3591839 (1971-07-01), Evans
patent: 3716907 (1973-02-01), Anderson
patent: 3772575 (1973-11-01), Hegarty et al.
patent: 4048438 (1977-09-01), Zimmerman
patent: 4136351 (1979-01-01), Sugawara et al.
RCA Technical Notes; Integration Techniques for Electronically Active Elements and Circuits; by Hui; Jun. 1967.

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