Thick-film integrated circuit device capable of being manufactur

Details Thick-film integrated circuit device capable of being manufactur Thick-film integrated circuit device capable of being manufactur

1987-12-01

1989-06-20

Albritton, C. L.

Electrical resistors

Mechanically variable

Resistance value varied by removing or adding material

21912169, H01C 10100

Patent

active

048412759

ABSTRACT:
A thick-film integrated circuit device comprises an insulating substrate, first and second conductors, formed on the insulating substrate by means of a thick-film forming method and spaced apart from each other, and a resistance-trimming resistor and a function-trimming resistor, both formed on the insulating substrate by means of the thick-film forming method. Both resistors are rectangular strips. The resistance-trimming resistor has two ends overlapping and thus electrically connected to the facing ends of the first and second conductors, respectively. The function-trimming resistor extends perpendicular to the second conductor, and has one end portion which extends at right angles to, overlaps and is therefore electrically coupled to the thin intermediate portion of the second conductor. A laser beam is applied onto the resistance-trimming resistor, while the resistance between those ends of the first and second conductors which face away from each other is being measured, thereby cutting a notch in the function-trimming resistor and thus greatly adjusting this resistance. A laser beam is applied onto the function-trimming resistor, thereby cutting a notch therein, cutting the resistor into two parts, and thus minutely adjusting the resistance between said ends of the first and second conductors.

REFERENCES:
patent: 2748234 (1956-05-01), Clarke et al.
patent: 3669733 (1969-12-01), Allington
patent: 4163315 (1979-08-01), Neese

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