Thick film hybrid circuit board device and method of manufacturi

Details Thick film hybrid circuit board device and method of manufacturi Thick film hybrid circuit board device and method of manufacturi

1991-09-24

1993-10-26

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

428901, 29844, 29847, H05K 100

Patent

active

052568369

ABSTRACT:
A thick film hybrid circuit board device is formed by laminating a first layer and a second layer on an insulative base board. The second layer being overlapped between over the insulative base board and the first layer has a recessed portion located at cross portion where peripheral edge portion of the first layer and a peripheral edge portion of the second layer are crossed. The recessed portion is formed in the shape of being recessed inwardly of the second layer. Bleedings generated from the second layer consisting of paste are held in the recessed portion, so that short circuit accidents caused by the bleedings mutually combined are effectively prevented.

REFERENCES:
patent: 3930304 (1976-01-01), Keller et al.
patent: 4259564 (1981-03-01), Ohkubo et al.
patent: 4835038 (1989-05-01), Kaneko et al.
patent: 4899126 (1990-02-01), Yamada
IBM Disclosure Bulletin "Thin Film Resistors on Metallized Substrates" Ameen, J. G. et al., vol. 21, No. 3, Aug. 1978.

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