Thick film gold metallization composition

Details Thick film gold metallization composition Thick film gold metallization composition

1982-11-19

1984-08-21

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

252514, H01B 102

Patent

active

044668309

ABSTRACT:
Paste composition for electrical terminal contact metallization containing 65 to 97% by weight gold and 3 to 25% by weight cadmium/antimony alloy dispersed in an inert liquid vehicle.

REFERENCES:
patent: 3970590 (1976-07-01), Hoffman et al.
patent: 4004057 (1977-01-01), Hoffman et al.
patent: 4219448 (1980-08-01), Ross
patent: 4230493 (1980-10-01), Felten
patent: 4235944 (1980-11-01), Felten

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