Thick film forming process

Details Thick film forming process Thick film forming process

1990-12-20

1992-05-26

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4273722, C23C 2600

Patent

active

051166429

ABSTRACT:
A thick film forming process according to the present invention comprises using the screen printing to form thick films in the vicinity of the edges or parts of large areas of a substrate, and next using the direct writing to form thick films of patterns on the other parts of the substrate. The process of this invention enables a circuit pattern in thick films to be changed easily in set conditions.

REFERENCES:
patent: 3798059 (1974-03-01), Astle
patent: 4324815 (1982-04-01), Mitami
patent: 4457861 (1984-07-01), Des Marais
patent: 4486738 (1984-12-01), Sadlo
patent: 4529477 (1985-07-01), Lundberg
patent: 4622239 (1986-11-01), Schoenthaler
patent: 4656048 (1987-04-01), Kudoh
patent: 4664945 (1987-05-01), Maeda
patent: 4720402 (1988-01-01), Wojuk
patent: 4743465 (1988-05-01), Saeki
Walter M. Mathias, "Additive Direct Writing: An Emerging Technology", Hybrid Circuit Technology, Apr., 1987, pp. 19-21.
J. R. Wylie, "Selective Flow Coating of Thin Film Integrated Circuits", Western Electric Technical Digest No. 36, Oct. 1974, pp. 33-34.
Patent Abstracts of Japan, vol. 9, No. 85, (E-308) [1808], Apr. 13, 1985.

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