Thick film copper via fill inks

Details Thick film copper via fill inks Thick film copper via fill inks

1994-01-04

1995-06-27

Brunsman, David

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 20, 501 26, 501 69, 428209, 428210, 428426, 428432, 428689, 428901, C03C 818

Patent

active

RE0349828

ABSTRACT:
Low-expansion devitrifying glass compositions exhibiting a negative-slope temperature coefficient of expansion over a temperature range from about 125.degree. C. to about 500.degree. C. are useful for the fabrication of thick film copper via-fill inks of multilayer printed-circuit boards.

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patent: 4301324 (1981-11-01), Kumar et al.
patent: 4313026 (1982-01-01), Yamada et al.
patent: 4714687 (1987-12-01), Holleran et al.
patent: 4808770 (1989-02-01), Prabhu et al.
patent: 4810420 (1989-03-01), Prabhu et al
patent: 4816615 (1989-03-01), Prabhu et al.
patent: 4830988 (1989-05-01), Hang et al.

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