Thick film copper conductor inks

Details Thick film copper conductor inks Thick film copper conductor inks

1988-12-09

1989-11-14

Baer, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, 252521, 106 113, 106 118, 501 19, 501 63, 501 69, 501 79, 501 70, H01B 106

Patent

active

048805670

ABSTRACT:
Improved copper conductor inks useful in the fabrication of multilevel circuits are disclosed. The inks comprise copper powder, a devitrifying glass frit selected from a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit and mixtures thereof, an adhesion promoting oxide, and a suitable organic vehicle. These inks are particularly adapted for applications where superior adhesion between the copper conductor ink and the underlying substrate or dielectric film is required.

REFERENCES:
patent: 4376725 (1983-03-01), Prabhu et al.
patent: 4385127 (1983-05-01), Chyung
patent: 4415624 (1983-11-01), Prabhu et al.
patent: 4521329 (1985-06-01), Suita et al.
patent: 4574321 (1985-04-01), Suita
patent: 4623482 (1986-11-01), Kuo et al.
patent: 4816615 (1989-03-01), Prabhu et al.

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