Thick film copper conductor inks

Details Thick film copper conductor inks Thick film copper conductor inks

1987-08-20

1989-03-28

Barr, Josephine

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361305, 361411, 501 19, 501 73, 501 79, 501 69, 501 70, 106 113, 106 118, 252512, 252518, 252521, H01B 106

Patent

active

048166154

ABSTRACT:
Improved copper conductor inks useful in the fabrication of multilevel circuits are disclosed. The inks comprise copper powder, a devitrifying glass frit selected from a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit and mixtures thereof, an adhesion promoting oxide, and a suitable organic vehicle. These inks are particularly adapted for applications where superior adhesion between the copper conductor ink and underlying substrate or dielectric film is required.

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