Thick-film copper conductor inks

Details Thick-film copper conductor inks Thick-film copper conductor inks

1987-08-20

1989-02-28

Barr, Josephine

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361305, 361411, 501 19, 501 73, 501 79, 501 69, 501 70, 106 113, 106 118, 252512, 252518, 252521, 252520, H05K 100, H01B 106

Patent

active

048087700

ABSTRACT:
Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a devitrifying glass frit which does not begin to flow until the furnace temperature is above about 700.degree. C., and a suitable organic vehicle. Devitrifying glass frits with these properties include a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit and mixtures thereof. The inks are advantageous in that they form copper conductor layers having excellent properties without the inclusion of traditional flux materials such as bismuth oxide.

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