Thick film copper conductor inks

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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Details

361305, 361411, 501 19, 501 20, 106 113, 106 118, 252512, 252521, H05K 109, C03C 804, C03C 816, C03C 818

Patent

active

047330180

ABSTRACT:
Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a novel zinc-aluminum-lead-borosilicate glass frit, bismuth oxide and a suitable organic vehicle. The inks are advantageous in that the films formed therefrom are oxidation resistant and have a reduced tendency for flux components to leach into adjacent dielectric films.

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Harper, C. A., Handbook of Thick Film Hybrid Microelectronics, McGraw-Hill, Inc., 1974, pp. 4-26 and 4-27.

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