Thick film copper conductor circuits

Stock material or miscellaneous articles – Composite – Of quartz or glass

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338307, 338314, 427 96, 427101, 427102, 427103, 428457, 428469, 428901, B32B 1520, B05D 512, H01C 1012

Patent

active

043169422

ABSTRACT:
A method for producing a thick film circuit (30) including a copper conductor pattern (19), thereby obviating the need for expensive precious metal compositions. In the process, a fritted copper paint (16) is applied to a ceramic substrate (18) and fired at a temperature of 850.degree. C. to 950.degree. C. and is oxidized. Concurrently, the paint (16) is adhesively joined to the nonreactive and nonconductive ceramic substrate (18). Next, a resistor paint (20) is applied in overlapping relationship with the air-heated copper conductor pattern (19) and fired at 850.degree. C. to 950.degree. C. The entire unit is then fired in a reducing atmosphere at a temperature of 260.degree. C. to 450.degree. C. to reduce the oxidized copper. The air-fired resistor pattern (21) can either be protected by a coating (40) or unprotected during the reducing atmosphere firing. The essential ingredients of the copper paint (16) are a frit (12) that is non-reducible under a hydrogen atmosphere, a copper powder (10) and a suitable screening agent ( 14).
In this new and improved three-step firing process, the copper conductors are compatible with existing ruthenium base resistors.

REFERENCES:
patent: 3998980 (1976-12-01), Antes et al.
patent: 4140817 (1979-02-01), Brown
patent: 4255291 (1981-03-01), Needes et al.

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