Thick film conductors having improved aged adhesion

Details Thick film conductors having improved aged adhesion Thick film conductors having improved aged adhesion

1979-01-15

1982-03-09

Padgett, Benjamin R.

Compositions

Electrically conductive or emissive compositions

Metal compound containing

252514, 252518, 106 114, 106 115, H01B 106

Patent

active

043188303

ABSTRACT:
Thick film conductors for hybrid microelectronic applications, having improved aged adhesion on various substrates such as 96% Al.sub.2 O.sub.3 and BeO, are provided. The improved aged adhesion at the solder joints is a result of the incorporation of cobalt-based additives into the inorganic binder.

REFERENCES:
patent: 4016308 (1977-04-01), Frazee
patent: 4050048 (1977-09-01), Frazee
patent: 4076894 (1978-02-01), Langley
patent: 4090009 (1978-05-01), Horowitz
patent: 4097653 (1978-06-01), Patterson et al.
patent: 4110124 (1978-08-01), Robertson et al.

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