Thick film conductor structure

Coating processes – Electrical product produced – Resistor for current control

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

338307, 338308, 357 67, 357 71, 427102, B05D 512

Patent

active

047285346

ABSTRACT:
In one embodiment of the present invention a thick film resistor structure comprising common materials is disclosed. The structure includes a supporting carrier as a base for the thick film resistor arrangement, which comprises a resistive material printed on the carrier, first and second noble metal terminating layers connected to either side of the resistive material, first and second barrier layers respectively connected to the first and second noble metal terminating layers, and first and second conducting layers respectively connected to said first and second barrier layers. The barrier layers are preferably composed of nickel or tungsten, whereas the noble metal terminating layers are preferably composed of silver. The resistive material, being formed between the terminating layers, is electrically connected to said copper conducting layers to form a precise thick film resistor structure whose resistance is measurable between said conducting layers.

REFERENCES:
patent: 2419537 (1947-04-01), Christensen
patent: 3900598 (1975-08-01), Hall et al.
patent: 4016525 (1977-04-01), Maher et al.
patent: 4031272 (1977-06-01), Khanna
patent: 4053866 (1977-10-01), Merz et al.
patent: 4072771 (1978-02-01), Grier, Sr.
patent: 4140817 (1979-02-01), Brown
patent: 4311730 (1982-01-01), Pedder
patent: 4441118 (1984-04-01), Fister et al.
patent: 4491860 (1985-01-01), Lim
patent: 4503090 (1985-03-01), Brown
patent: 4546373 (1985-10-01), Todd et al.
DuPont's MYDAS (.TM.) System Press Release.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thick film conductor structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thick film conductor structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thick film conductor structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-996950

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.