Thick film conductor compositions with improved adhesion

Details Thick film conductor compositions with improved adhesion Thick film conductor compositions with improved adhesion

1994-12-06

1996-05-21

McGinty, Douglas J.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252513, 252519, 252521, 252518, 252512, H01B 122, H01B 116, C09D 524

Patent

active

055186637

ABSTRACT:
The invention is directed to a thick film conductor composition wherein such compositions have improved solderability and adhesion to substrates due to the addition of a crystalline material from the feldspar family.

REFERENCES:
patent: 3583931 (1971-06-01), Bouchard et al.
patent: 4302362 (1981-11-01), Hoffman et al.
patent: 4420422 (1983-12-01), Ferretti
patent: 4636332 (1987-01-01), Craig et al.
patent: 4959330 (1990-09-01), Donohue et al.
patent: 5264156 (1993-11-01), Gora et al.
patent: 5344592 (1994-09-01), Wilczek et al.
The Condensed Chemical Dictionary, 4th ed., 1950, Turner, Francis M., ed., Reinhold Publishing Corporation, p. 288.

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