Thick film conductor compositions for use with an aluminum nitri

Compositions – Electrically conductive or emissive compositions – Free metal containing

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252514, 252518, 252521, 501 59, 501 61, 501 66, 501 67, 501 75, 501 77, H01B 106

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050891723

ABSTRACT:
A thick film conductor composition adapted to be bonded to an aluminum nitride substrate is provided which comprises a sufficient amount of conductive metallic material to render the conductor composition electrically conductive when bonded to the substrate, a glass frit binder for the metallic material capable of being bonded to the substrate, and a lithium containing compound capable of reacting with the substrate upon heating so as to aid in adherently bonding the conductor composition to the aluminum nitride substrate. A thick film conductor bonded onto the surface of an aluminum nitride substrate as well as a method of producing the same are also provided.

REFERENCES:
patent: 4219448 (1980-08-01), Ross
patent: 4225468 (1980-09-01), Donohue et al.
patent: 4251397 (1981-02-01), Scheiber
patent: 4400214 (1983-08-01), Ogawa et al.
patent: 4476039 (1984-10-01), Hormadaly
patent: 4540673 (1985-09-01), Takeda et al.

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