Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2005-09-06
2005-09-06
Kopec, Mark (Department: 1751)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C427S058000, C200S512000
Reexamination Certificate
active
06939484
ABSTRACT:
The present invention relates to a thick film conductor composition comprising: (a) electrically conductive silver powder; (b) PVDF/HFP polymer resin, copolymers of a PVDF/HFP polymer resin, and mixtures thereof; dissolved in (c) organic solvent, with the provisos that the PVDF/HFP resin has a melt viscosity of 0.2–0.7 kPoise and a DSC melt temperature in the range of 85–98° C.
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patent: 4595605 (1986-06-01), Martin et al.
patent: 5089173 (1992-02-01), Frentzel et al.
patent: 5653918 (1997-08-01), Towlson
patent: 6445128 (2002-09-01), Bush et al.
patent: 6787993 (2004-09-01), Bush et al.
E. I. du Pont de Nemours and Company
Kopec Mark
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