Thick film conductor compositions and the use thereof in...

Compositions – Electrically conductive or emissive compositions – Free metal containing

Reexamination Certificate

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C252S519510, C264S104000, C361S321100, C361S523000, C501S015000, C501S016000, C501S032000

Reexamination Certificate

active

07611645

ABSTRACT:
The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures thereof; (b) one or more selected inorganic binders and/or mixtures thereof, and dispersed in (c) organic medium, and wherein said glass compositions are immiscible or partially miscible with remnant glasses present in the low temperature co-fired ceramic substrate glasses at the firing conditions.The present invention is further directed to methods of forming multilayer circuits utilizing the above composition and the use of the composition in high frequency applications (including microwave applications).

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