Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2006-04-05
2009-11-03
Kopec, Mark (Department: 1796)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C252S519510, C264S104000, C361S321100, C361S523000, C501S015000, C501S016000, C501S032000
Reexamination Certificate
active
07611645
ABSTRACT:
The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures thereof; (b) one or more selected inorganic binders and/or mixtures thereof, and dispersed in (c) organic medium, and wherein said glass compositions are immiscible or partially miscible with remnant glasses present in the low temperature co-fired ceramic substrate glasses at the firing conditions.The present invention is further directed to methods of forming multilayer circuits utilizing the above composition and the use of the composition in high frequency applications (including microwave applications).
REFERENCES:
patent: 4381945 (1983-05-01), Nair
patent: 4654095 (1987-03-01), Steinberg
patent: 4880567 (1989-11-01), Prabhu et al.
patent: 4906404 (1990-03-01), Suehiro et al.
patent: 5175130 (1992-12-01), Kondo et al.
patent: 5254191 (1993-10-01), Mikeska et al.
patent: 5298330 (1994-03-01), Stadnicar, Jr. et al.
patent: 5378408 (1995-01-01), Carroll et al.
patent: 5518663 (1996-05-01), Labranche et al.
patent: 5645765 (1997-07-01), Asada et al.
patent: 5744232 (1998-04-01), Bailey et al.
patent: 5948536 (1999-09-01), Suzuki et al.
patent: 6124224 (2000-09-01), Sridharan et al.
patent: 6147019 (2000-11-01), Donohue
patent: 6982864 (2006-01-01), Sridharan et al.
patent: 7176152 (2007-02-01), Brown et al.
patent: 7189343 (2007-03-01), Mears
patent: 2003/0207745 (2003-11-01), Masuko
patent: 2004/0245508 (2004-12-01), Wang et al.
patent: 2005/0104046 (2005-05-01), Wang et al.
patent: 2006/0009036 (2006-01-01), Bacher et al.
patent: 2006/0028788 (2006-02-01), Sridharan et al.
patent: 2006/0163768 (2006-07-01), Needes et al.
patent: 0132810 (1984-07-01), None
patent: 0 451 771 (1991-10-01), None
patent: 1 534 053 (2005-05-01), None
patent: 772675 (1957-04-01), None
McCombs Mark Frederick
Nair Kumaran Manikantan
E. I. du Pont de Nemours and Company
Kopec Mark
Nguyen Khanh Tuan
LandOfFree
Thick film conductor compositions and the use thereof in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thick film conductor compositions and the use thereof in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thick film conductor compositions and the use thereof in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4100587