Thick film conductor compositions

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427102, 427103, 427125, 4271262, 4271263, 4271265, 4273762, 106 113, 106 114, 106 115, 106 118, 106 119, 106 121, 252512, 252514, 252518, 29610R, 29620, 29825, 29829, B05D 512

Patent

active

045406049

ABSTRACT:
A copper-containing thick film conductor composition comprising a mixture of finely divided particles of (a) a conductive material containing copper metal, (b) inorganic binder and (c) 0.2-5% wt. of a noncuprous metal selected from the group consisting of tungsten, molybdenum, rhenium and alloys and mixtures thereof all dispersed in organic medium. The metal particles must be within certain narrow ranges of particle size.

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