Thick film conductor composition(s) and processing...

Compositions – Electrically conductive or emissive compositions – Free metal containing

Reexamination Certificate

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C427S097200

Reexamination Certificate

active

07666328

ABSTRACT:
The invention relates to thick film conductor compositions which are useful in application to both via-fill and/or line conductors to manufacture of Low Temperature Co-fireable Ceramic (LTCC) devices and other Multilayer Interconnect (MLI) ceramic composite circuits such as Photosensitive Tape On Substrates (PTOS); gold, silver and mixed metal multilayer circuits and devices. The invention is useful for forming microwave and other high frequency circuit components selected from the group comprising: antenna, filters, baluns, beam former, I/O's, couplers, via feedthroughs, EM coupled feedthroughs, wirebond connection, and transmission lines.

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