Thick film conductive composition and process for use in the...

Details Thick film conductive composition and process for use in the... Thick film conductive composition and process for use in the...

2007-04-12

2010-06-08

Kopec, Mark (Department: 1796)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C427S096100, C136S256000

Reexamination Certificate

active

07731868

ABSTRACT:
The present invention is directed to a thick film conductive composition comprising: a) electrically conductive silver powder; b) ZnO powder; c) lead-free glass frits wherein based on total glass frits: Bi2O3: >5 mol %, B2O3: <15 mol %, BaO: <5 mol %, SrO: <5 mol %, Al2O3: <5 mol %; and d) organic medium, wherein (the content of ZnO/the content of the silver powder)×100 is more than 2.5.

REFERENCES:
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patent: 4737197 (1988-04-01), Nagahara et al.
patent: 5623389 (1997-04-01), Sanada
patent: 5645765 (1997-07-01), Asada et al.
patent: 2002/0005507 (2002-01-01), Matsumoto
patent: 2004/0214016 (2004-10-01), Adachi
patent: 2006/0231801 (2006-10-01), Carroll et al.
patent: 2006/0289055 (2006-12-01), Sridharan et al.
patent: 1 717 858 (2006-11-01), None
patent: 2001-313400 (2001-11-01), None
PCT International Search Report and Written Opinion for International Application No. PCT/US2008/004657 dated Jul. 15, 2008.

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